In case you missed it, Advanced Assembly recently was featured on Manufacturing Marvels.
Across all industries, component shortages are forcing design engineers to seek alternative parts and materials, or entirely redesign their projects. With analysts predicting the shortages to last potentially through 2018, the market is scrambling to find ways to keep projects on-time and on-budget. One common practice currently compounding the challenge of limited supply is a refusal to accept part substitutions.
The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.
Unlike the perimeter-only package type, which place soldering pins along the edge of the device, a BGA aligns its solder balls in a grid beneath the bottom surface of the device. As a result, this approach leaves a considerably smaller footprint on the PCB and induces better thermal and electrical properties than a perimeter-style mounting package.
“I give each PCB manufacturer three strikes before trying a new one
(unless the mistakes are REALLY bad).”
This comment, made on Reddit a couple of months ago, caught our attention. Is it true design engineers accept as fact that they must suffer through mistake after mistake before getting circuit boards correctly manufactured and assembled? And, if this is reality, what are the consequences to an engineer’s projects? Are project plans created with time for assumed re-dos? Are budgets put together knowing companies likely will need to pay for 2 or 3 orders before getting boards that work? Most importantly, why is this acceptable?
When they look at an integrated circuit, most people do not realize that what they are looking at is simply the package that encapsulates the actual IC or “the brains.” Integrated circuit packaging is something that happens to parts before they ever leave the manufacturing facility meaning that most designers and engineers never see the raw IC itself. Although the encapsulated IC may be the portion that brings value to the overall product, the package has an incredibly large effect on many different aspects of performance. While different packages are promoted by different manufacturers along with their specific pros and cons, thi article will discuss the packages in general and the different attributes to consider when making a selection.
#1. Incorrect Gerber File Format for Stencil Paste
Fix: The gerber format MUST be RS274X (opposed to RS274D). The RS274X
format is the most current industry standard and includes aperture information in the gerber itself instead of requiring a separate aperture file.. (Google for "RS274X format") All current version CAD programs can generate the -X format although some may default to the older format for the sake of backwards compatibility.
Which one should you choose?
Sometimes customer purchase the parts and boards for their designs first, then send all the components in a single box or "kit." Often this is done in an attempt to save money or excercise additional control over the project. However, one out of every two consignment kits go on hold causing delays of 1 - 5 days.
Read this Consignment vs. Turn-Key Assembly overview to determine which service is the best for your upcoming assembly project.